An endless diamond wire loop is a continuous cutting tool made of high-tensile steel wire coated with diamond particles. Unlike traditional segmented blades, its closed-loop design enables uninterrupted cutting, widely used in slicing ultra-hard materials like silicon ingots, sapphire, and ceramics.
How It Works
The wire moves at high speed (15-30 m/s) while abrasive diamond particles grind through materials. Coolants prevent overheating, ensuring micron-level precision.
Key Advantages
Efficiency: 3x faster than slurry-based cutting
Eco-friendly: Reduces slurry waste by 90%
Thin Kerf: Minimizes material loss (cutting width <120μm)
Applications
Dominates solar cell production (silicon wafer slicing) and semiconductor manufacturing. Emerging uses include artwork restoration and aerospace composite processing. This technology revolutionized material processing, balancing industrial demands with sustainability.
