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Revealed! Diamond wire cutting: the collision of technology and art

2024-12-06 18:09:59

Diamond wire cutting technology plays a vital role in modern industrial manufacturing.This advanced cutting method uses diamond, the hardest substance in nature, as a cutting tool to achieve precise cutting of materials through unidirectional or reciprocating motion.The working principle of the diamond wire cutting machine is to embed diamond particles into the metal wire to form a cutting line containing fixed diamond particles.

This line moves at a certain speed and forms a relative grinding motion with the object to be cut, thereby achieving the purpose of cutting.This cutting method is particularly suitable for processing non-conductive materials, making up for the shortcomings of wire electric discharge machines (WEDM) in this regard.Compared with traditional cutting technology, diamond wire cutting has significant advantages.First, it has less cutting leakage, which means higher material utilization, which is crucial for cost control.Secondly, due to the long life of the diamond wire and the fast cutting speed, this directly increases the production capacity and brings higher efficiency and greater economic benefits to the enterprise.In addition, the damage layer caused by diamond wire cutting is smaller than that of traditional mortar wire cutting, which facilitates the production of thinner silicon wafers and meets the strict requirements for material thickness in specific industries.In terms of cost, the cost advantage of diamond wire-cut monocrystalline silicon wafers is mainly reflected in the small cutting loss, high silicon material utilization rate and increased machine productivity.These advantages reduce the silicon consumption per unit of energy produced by diamond wire cutting, while increasing production capacity, thereby reducing the cost of unit silicon wafers.

Specifically, the cost of diamond wire cutting single crystal silicon wafers can be reduced by about 20% compared to mortar slicing, which means that about 10 more silicon wafers can be produced per kilogram of silicon material, which greatly reduces the output and processing costs of production waste.Diamond wire cutting technology not only provides an efficient and economical cutting solution, but is also of great significance in promoting technological progress and industrial upgrading of related industries.

As technology continues to mature and its application scope expands, diamond wire cutting will occupy a more important position in the future manufacturing industry.

  • Endless Diamond Wire Loop Saw Cutting Machine
  • Endless Diamond Wire Loop Saw Cutting Machine
  • Endless Diamond Wire Loop Saw Cutting Machine
  • Endless Diamond Wire Loop Saw Cutting Machine

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