By studying the influence of process parameters such as wire speed and feed speed in diamond wire saw cutting on the surface quality of silicon carbide ceramics, and using the single factor test method to analyze the relationship between its surface morphology and surface roughness and wire speed, feed speed, and feed speed to wire speed ratio R, the following conclusions are drawn: (1) When diamond wire saw cuts silicon carbide ceramics, the surface morphology formed is the result of the comprehensive removal of plasticity and brittleness of the material. (2) When the workpiece feed speed is the same, when the wire speed of the diamond wire saw increases from 0.4 m/s to 1.3 m/s, the area proportion of the plastic stripe smooth area on the surface of silicon carbide ceramics increases, while that of the brittle peeling area decreases, the size and number of micro-pits decrease, and the concave-convex feeling is significantly reduced, which effectively improves the surface morphology of the cutting surface. The surface roughness value in the feed direction decreases by 20.35%, and that in the wire saw direction decreases by 10.45%. (3) Under the same conditions of diamond wire saw wire speed, the surface quality of silicon carbide ceramics gradually decreases as the feed speed increases from 6 μm/s to 24 μm/s, and the number and area of micro-pits generated by brittle peeling of the workpiece material increase, while the proportion of the plastic deformation area gradually decreases, thus affecting the surface morphology of the workpiece, resulting in the surface roughness values in the feed direction and the wire saw direction increasing by 12.07% and 3.91%, respectively.
