Engineering ceramics have excellent properties such as light weight, corrosion resistance, high temperature resistance, wear resistance, small thermal expansion coefficient, strong thermal shock resistance and low friction coefficient, and have been widely used in various fields. Silicon carbide ceramics are one of the materials with better comprehensive performance in the engineering ceramic family. At present, silicon carbide ceramics are mainly used in industrial fields such as aerospace, construction and building materials, and national defense and military industry. However, silicon carbide ceramics have the same high hardness and high brittleness as other engineering ceramic materials. This characteristic makes the material removal rate of silicon carbide ceramics very low during processing, and it is easy to cause surface damage, and the processing cost is very high. In recent years, cutting technology has been widely used in the cutting process of engineering ceramics, but the Mohs hardness of silicon carbide ceramics is as high as 9.2~9.3, second only to the superhard material diamond. It is difficult to cut it using traditional cutting methods, and it is difficult to obtain a good processing surface. Diamond wire saw cutting technology is a new technology developed in recent years for cutting hard and brittle materials. It is characterized by high cutting efficiency, small material surface damage, energy saving and environmental protection, etc. Therefore, the application of this technology in the cutting of silicon carbide ceramics is conducive to improving the cutting efficiency of silicon carbide ceramics and reducing its surface damage. However, the surface morphology and surface roughness formed by the sawing of the workpiece directly determine the processing quality of the material. Therefore, how to optimize the diamond wire saw cutting process to obtain a high-precision cutting surface is of great significance to the research on the precision sawing of the workpiece.
