Diamond wire saws for cutting are mainly bonded diamond wire saws, and their research focuses on the manufacturing of wire saw base materials, diamond plating on metal wires, and the cutting process of the cut materials. In the 1970s, MECH first applied diamond wire saws in the field of semiconductor material cutting; after numerous scholars explored, they successively manufactured a variety of cutting tools such as diamond multi-wire saws, reciprocating linear motion cutting, and unidirectional continuous motion wire saws that can be used for silicon wafer processing. Among them, the unidirectional continuous motion wire saw is a wire saw cutting form that uses annular diamond wire for high-speed circular cutting, and has a fast cutting speed and good cutting surface quality.
With the development of semiconductor technology and optical technology, the requirements for precision wire cutting technology for brittle materials are getting higher and higher. In order to obtain better surface quality and reduce the subsequent processing allowance, the wire saw should have a higher and more stable wire speed during cutting. Specifically, it is reflected in:
(1) Reduce the number of reversals during the cutting process, or even directly avoid the reversal operation during the processing process, so as to avoid the generation of surface ripples;
(2) Increase the cutting line speed to achieve high-speed and efficient cutting and improve the surface quality of the cutting surface;
(3) Under the premise of ensuring high-speed cutting without breaking the wire, reduce the wire diameter and reduce the material loss caused by the cutting seam;
(4) Study the wire material and processing method to increase the service life of the wire;
(5) Reduce the cost of machine tools
