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Development direction of diamond wire silicon wafer cutting equipment
Development direction of diamond wire silicon wafer cutting equipment High wire speed and high capacity support single GW investment reduction According to fracture mechanics theory and the properties of silicon materials, when the maximum cutting depth of diamond abrasive is greater than the critical cutting depth of silicon materials, a transition from plastic cutting to brittle fracture cutting will occur. Therefore, within the allowable range of diamond wire load, appropriately increasing the wire speed during multi-wire cutting is conducive to removing silicon materials in the ductile domain, and the surface quality of silicon wafers will be improved. For silicon wafer cutting equipment manufacturers, while considering cost reduction, it is necessary to further improve the overall stability of the equipment, especially the stability of tension control, the stability of the spindle bearing box and the strength of the equipment. Now, the mainstream slicing line speed on the market is 1800~2100 m/min. Since 2017, the increase in the line speed of the slicer has begun to diverge. By 2019, some diamond wire slicer manufacturers are constrained by the choice of technical routes and their own R&D capabilities. The limit remains at 1800m/min, and a few manufacturers with strong R&D capabilities continue to...
Size changes of photovoltaic silicon wafer
Size changes of photovoltaic silicon wafers The size of photovoltaic silicon wafers is derived from semiconductor silicon wafers. In terms of development, photovoltaics lag behind semiconductors by 1 to 2 generations. Over the years, the size of semiconductor silicon wafers has continued to increase, and photovoltaic silicon wafers have also experienced a process from small to large. Driven by cost dilution and component quality improvement, in the 40 years since 1981, the size of photovoltaic silicon wafers has grown from 100mm to 210mm, and the specifications have doubled. 1981-2012: 100mm-156mm Between 1981 and 2012, the margins of silicon wafers were 100mm and 125mm, and 125mm silicon wafers were dominant. Then, the margins of silicon wafers increased significantly from 125mm to 156mm (ie M0), an increase of 54.1%. 156MM silicon wafers have gradually become a popular choice for P-type monocrystalline silicon wafers and multicrystalline silicon wafers. Around 2014, 125mm P-type silicon wafers are basically eliminated and are only used in some IBC and HIT battery modules. 2012-2018: M0-M2 type At the end of 2013, LONGi, Zhonghuan, Jinglong, Yangguang Energy, and Comtec took the lead in unifying the M1 (margin 156.75mm, diameter 205mm) and M2 (margin 156.75mm, diameter 210mm) standards to 156.75mm....
Processing flow of silicon ingots in the semiconductor industry
Processing flow of silicon ingots in the semiconductor industry In the stage of single crystal silicon wafer preparation, silicon ingots need to be processed into raw silicon wafers or bare silicon wafers with high surface accuracy and surface quality to prepare for the flattening of processes such as photolithography in the first half of the IC process. An ultra-smooth and damage-free substrate surface is required here. For silicon wafers with a diameter of ≤200mm, the traditional silicon wafer processing process is: Single crystal growth → cutting → outer diameter barrel grinding → flat edge or V-groove processing → wafering → chamfering → grinding → etching → polishing → cleaning → packaging. Planting: The purpose is to cut off the head and tail of the single crystal silicon ingot and the part that exceeds the customer’s specifications, split the single crystal silicon rod into a length that can be processed by the slicing equipment, and cut the test piece to measure the resistivity and oxygen content of the single crystal silicon rod. Quantity. The process traditionally uses a diamond band saw or a single diamond wire to cut. In recent years, after the emergence of endless diamond wire cutting, a large-scale...
Why is diamond wire loop saw cutting more and more in the photovoltaic industry?
Why is diamond wire loop saw cutting more and more in the photovoltaic industry? With the continuous development of the photovoltaic industry, the demand for silicon wafers is increasing, and the quality and cutting efficiency of silicon wafers have also put forward higher requirements. As an efficient cutting tool, diamond wire loop has the advantages of fast cutting speed, high precision and low cost, so it has been widely used in the photovoltaic industry. The photovoltaic industry adopts annular diamond wire loop cutting mainly for the following reasons: Cutting performance: Diamond wire loop cutting technology has the advantages of high output rate, fast cutting speed and low environmental pollution. Compared with traditional mortar cutting technology, diamond wire cutting can improve the cutting efficiency and yield of silicon wafers, while reducing environmental pollution. Cost considerations: Diamond wire loop cutting technology can improve the utilization rate of raw materials, reduce losses during cutting, and thus reduce production costs. Market demand: With the rapid development of the photovoltaic industry, the demand for silicon wafers is increasing. Endless diamond wire cutting technology can meet the market demand for efficient and high-quality silicon wafers. In summary, the photovoltaic industry adopts diamond wire loop cutting technology...
Advantages of Diamond Wire Loop Colored Crystals
Advantages of Diamond Wire Loop Colored Crystals: 1.Precision and Efficiency Superior precision: Diamond wire loop cutting enables precise and intricate cuts, ensuring the desired shape and size of colored crystals. Improved efficiency: With diamond wire loop cutting technology, faster cutting speeds can be achieved, reducing production time and increasing productivity. 2. Minimum material loss Reduced waste: Diamond wire loop cutting minimizes material loss during the cutting process, maximizing the yield of valuable colored crystals. Cost-effectiveness: By minimizing waste, diamond wire loop cutting helps optimize the use of raw materials, reducing overall production costs. 3.Versatile Adaptable to a variety of crystal types: Diamond wire loop cutting technology can be applied to a wide range of colored crystals, including sapphire, emerald, ruby, and amethyst, among others. Customization options: The flexibility of diamond wire loop cutting allows for the creation of custom shapes and designs, catering to the preferences of individual customers. 4.Improved surface finish, smooth polishing effect Diamond wire loop cutting produces clean and smooth cuts, Minimizes the need for additional polishing or finishing. Enhanced clarity and brilliance: The precise cuts achieved through diamond wire loop cutting enhance the clarity and brilliance of the crystal, showcasing its natural beauty. 5. Reduced risk...
Diamond Wire Cutting of Colored Crystals: A Comprehensive Guide
Diamond Wire Cutting of Colored Crystals: A Comprehensive Guide Diamond wire loop cutting has revolutionized the cutting process of colored crystals, offering many advantages over traditional methods. This article aims to explore the unique advantages of using diamond wire loop cutting technology specifically for colored crystals. From minimizing material loss to achieving precise and accurate cuts, diamond wire loop cutting has become an indispensable tool in the field of crystal manufacturing. Types of Colored Crystals: 1. Sapphire Blue Sapphire: The classic blue sapphire, known for its deep and velvety hue. Fancy Sapphire: These sapphires showcase a range of colors beyond the traditional blue, including pink, yellow, and green. Padparadscha Sapphire: A rare and valuable variety with a delicate pink-orange hue, reminiscent of a tropical sunset. 2. Emerald Colombian Emerald: Known for its rich green color and excellent clarity, Colombian emeralds are highly sought after. Zambian Emerald: These emeralds typically exhibit a slightly bluish-green hue and are valued for their transparency. Brazilian Emerald: Brazilian emeralds are known for their deep green color and natural inclusions, which give them a unique character. 3. Ruby Burmese Ruby: Highly prized for its pigeon blood red color, Burmese rubies are considered the most valuable. Thai...

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