Diamond Wire Saw Cutting Machine--Aite Endless Diamond Wire Saw-3-Aite Endless Diamond Wire Saw--Redefine single wire cutting equipment

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Mechanism and process of cutting silicon carbide ceramics with diamond wire saw（2）
By studying the influence of process parameters such as wire speed and feed speed in diamond wire saw cutting on the surface quality of silicon carbide ceramics, and using the single factor test method to analyze the relationship between its surface morphology and surface roughness and wire speed, feed speed, and feed speed to wire speed ratio R, the following conclusions are drawn: (1) When diamond wire saw cuts silicon carbide ceramics, the surface morphology formed is the result of the comprehensive removal of plasticity and brittleness of the material. (2) When the workpiece feed speed is the same, when the wire speed of the diamond wire saw increases from 0.4 m/s to 1.3 m/s, the area proportion of the plastic stripe smooth area on the surface of silicon carbide ceramics increases, while that of the brittle peeling area decreases, the size and number of micro-pits decrease, and the concave-convex feeling is significantly reduced, which effectively improves the surface morphology of the cutting surface. The surface roughness value in the feed direction decreases by 20.35%, and that in the wire saw direction decreases by 10.45%. (3) Under the same conditions of diamond wire saw wire speed, the surface quality of...
Mechanism and process of cutting silicon carbide ceramics with diamond wire saw（1）
Engineering ceramics have excellent properties such as light weight, corrosion resistance, high temperature resistance, wear resistance, small thermal expansion coefficient, strong thermal shock resistance and low friction coefficient, and have been widely used in various fields. Silicon carbide ceramics are one of the materials with better comprehensive performance in the engineering ceramic family. At present, silicon carbide ceramics are mainly used in industrial fields such as aerospace, construction and building materials, and national defense and military industry. However, silicon carbide ceramics have the same high hardness and high brittleness as other engineering ceramic materials. This characteristic makes the material removal rate of silicon carbide ceramics very low during processing, and it is easy to cause surface damage, and the processing cost is very high. In recent years, cutting technology has been widely used in the cutting process of engineering ceramics, but the Mohs hardness of silicon carbide ceramics is as high as 9.2~9.3, second only to the superhard material diamond. It is difficult to cut it using traditional cutting methods, and it is difficult to obtain a good processing surface. Diamond wire saw cutting technology is a new technology developed in recent years for cutting hard and brittle materials. It...
Development of consolidated diamond wire saw cutting technology forbrittle materials
Diamond wire saws for cutting are mainly bonded diamond wire saws, and their research focuses on the manufacturing of wire saw base materials, diamond plating on metal wires, and the cutting process of the cut materials. In the 1970s, MECH first applied diamond wire saws in the field of semiconductor material cutting; after numerous scholars explored, they successively manufactured a variety of cutting tools such as diamond multi-wire saws, reciprocating linear motion cutting, and unidirectional continuous motion wire saws that can be used for silicon wafer processing. Among them, the unidirectional continuous motion wire saw is a wire saw cutting form that uses annular diamond wire for high-speed circular cutting, and has a fast cutting speed and good cutting surface quality. With the development of semiconductor technology and optical technology, the requirements for precision wire cutting technology for brittle materials are getting higher and higher. In order to obtain better surface quality and reduce the subsequent processing allowance, the wire saw should have a higher and more stable wire speed during cutting. Specifically, it is reflected in: (1) Reduce the number of reversals during the cutting process, or even directly avoid the reversal operation during the processing process, so as...
Advantages of Endless Diamond Wire Saw
The endless diamond wire saw presents significant environmental advantages compared to other cutting technologies, such as water jet cutting or internal circular slicing machines. The key environmental benefits stem from the unique characteristics of this cutting machine. 1，Low Heat Generation: The utilization of an extremely fine diamond wire as the cutting tool minimizes heat generation during the cutting process. This is in stark contrast to some traditional methods that may produce higher levels of heat. The reduced heat contributes to energy efficiency and mitigates potential environmental impacts associated with heat emissions. 2，Water Circulation System: The incorporation of a water tank with a circulating water system further enhances the environmental friendliness of the endless diamond wire saw. This system not only aids in maintaining optimal cutting conditions but also serves as an effective cooling mechanism. The use of water as a coolant minimizes the risk of thermal damage and ensures a smoother cutting process. 3，Pollution Reduction: The closed-loop nature of the diamond wire, typically within 10 meters, eliminates the need for extensive lengths of cutting material. This reduces waste and contributes to a cleaner working environment. Additionally, the fine precision of the diamond wire minimizes the generation of waste material during...
Diamond Wire Cutting Technology
Diamond wire cutting usually has the characteristics of precise positioning and smooth and uniform cross-section. It is the most flexible method for sample structure and material analysis in the quality inspection process. The wire diameter of 0.08-0.5mm brings minimal kerf loss. Due to its low heat generation, even temperature-sensitive materials such as rubber products can be cut well. Depending on the sample properties, wet cutting or dry cutting can be selected. The edges of the section are sharp and there is no adhesion. When cutting composite materials, it will not cause mutual contamination between different materials. The maximum cross-section length can reach 375mm. One disadvantage of this method is that the cutting efficiency is relatively low, but this is often not so important in the laboratory. Due to these characteristics and the simple and safe operation of diamond wire saws, more and more laboratories around the world choose this cutting technology or use it to expand their means of processing samples.
Diamond Wire Cutting Machine Introduction
Diamond wire cutting machine is a CE-certified cutting equipment. It is mainly used for precision cutting of material analysis samples, such as ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials and biomedical materials. This machine is particularly suitable for precision cutting of ultra-thin slices, and the thickness of the slice can reach 0.2mm. Diamond wire cutting machine is a continuous cutting type diamond wire cutting machine. After setting the cutting program, the sample is continuously fed without manual adjustment. The size accuracy of the sample after cutting is high, within the range of ±10μm. The cutting wire of the diamond wire cutting machine adopts a single wire reciprocating motion mode. The length of the diamond wire that can be used is (80m or 150m, determined by the specific equipment model). The service life of the line is long, which greatly improves the cutting efficiency. The tension wheel adopts a pneumatic tensioning mode. The size of the air pressure can be adjusted according to the thickness of the wire diameter. When the wire diameter is too thin, it can effectively protect the cutting wire from breaking due to excessive tension. When the cutting machine is used with...

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